Publisher: Allied Market Research
# of Pages: 505
Rating:
1 User License $5,370
Publication Date: April, 2019
Price: $5,370 / User License
Buy Now
RPT40831
LIC503
1 User $5,370
Chapter: 1: INTRODUCTION
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Secondary research
1.4.2. Primary research
1.5. Analyst tools and models
Chapter: 2: EXECUTIVE SUMMARY
2.1. Key findings of the study
2.2. CXO perspective
Chapter: 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top investment pockets
3.2.2. Top winning strategies
3.3. Porter’s five forces analysis
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Perfectly suitable properties for electronic applications
3.4.1.2. Increased consumer electronic industry output and trend for miniaturization
3.4.2. Restraint
3.4.2.1. Improper section of potting resin
3.4.3. Opportunity
3.4.3.1. Gradual adoption of two component polyurethane potting compounds
3.5. Top player positioning, 2017
Chapter: 4: GLOBAL POTTING COMPOUNDS MARKET, BY RESIN TYPE
4.1. Overview
4.1.1. Market size and forecast
4.2. Epoxy
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis, by country
4.3. Polyurethane
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis, by country
4.4. Silicone
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis, by country
4.5. Polyester
4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market share analysis, by country
4.6. Polyamide
4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market share analysis, by country
4.7. Polyolefin
4.7.1. Key market trends, growth factors, and opportunities
4.7.2. Market size and forecast, by region
4.7.3. Market share analysis, by country
4.8. Acrylics
4.8.1. Key market trends, growth factors, and opportunities
4.8.2. Market size and forecast, by region
4.8.3. Market share analysis, by country
Chapter: 5: GLOBAL POTTING COMPOUNDS MARKET, BY CURING TECHNIQUE
5.1. Overview
5.1.1. Market size and forecast
5.2. UV Curing
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis, by country
5.3. Thermal Curing
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis, by country
5.4. Room Temperature Curing
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market share analysis, by country
Chapter: 6: GLOBAL POTTING COMPOUNDS MARKET, BY APPLICATION
6.1. Overview
6.1.1. Market size and forecast
6.2. Electrical
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market size and forecast, by type
6.2.4. Market share analysis, by country
6.3. Electronics
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market size and forecast, by type
6.3.4. Market share analysis, by country
Chapter: 7: GLOBAL POTTING COMPOUNDS MARKET, BY END USER
7.1. Overview
7.1.1. Market size and forecast
7.2. Electronics
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market share analysis, by country
7.3. Aerospace
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market share analysis, by country
7.4. Automotive
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market share analysis, by country
7.5. Industrial
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market share analysis, by country
7.6. Others
7.6.1. Key market trends, growth factors, and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market share analysis, by country
Chapter: 8: GLOBAL POTTING COMPOUNDS MARKET, BY REGION
8.1. Overview
8.1.1. Market size and forecast
8.2. North America
8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by resin type
8.2.3. Market size and forecast, by curing technique
8.2.4. Market size and forecast, by application
8.2.4.1. Market size and forecast, by electrical application
8.2.4.2. Market size and forecast, by electronics application
8.2.4.3. Market size and forecast, by electrical application
8.2.4.4. Market size and forecast, by electronics application
8.2.5. Market size and forecast, by end-user
8.2.6. Market share analysis, by country
8.2.7. U.S.
8.2.7.1. Market size and forecast, by resin type
8.2.7.2. Market size and forecast, by curing technique
8.2.7.3. Market size and forecast, by application
8.2.7.3.1. Market size and forecast, by electrical application
8.2.7.3.2. Market size and forecast, by electronics application
8.2.7.3.3. Market size and forecast, by electrical application
8.2.7.3.4. Market size and forecast, by electronics application
8.2.7.4. Market size and forecast, by end-user
8.2.8. Canada
8.2.8.1. Market size and forecast, by resin type
8.2.8.2. Market size and forecast, by curing technique
8.2.8.3. Market size and forecast, by application
8.2.8.3.1. Market size and forecast, by electrical application
8.2.8.3.2. Market size and forecast, by electronics application
8.2.8.3.3. Market size and forecast, by electrical application
8.2.8.3.4. Market size and forecast, by electronics application
8.2.8.4. Market size and forecast, by end-user
8.2.9. Mexico
8.2.9.1. Market size and forecast, by resin type
8.2.9.2. Market size and forecast, by curing technique
8.2.9.3. Market size and forecast, by application
8.2.9.3.1. Market size and forecast, by electrical application
8.2.9.3.2. Market size and forecast, by electronics application
8.2.9.3.3. Market size and forecast, by electrical application
8.2.9.3.4. Market size and forecast, by electronics application
8.2.9.4. Market size and forecast, by end-user
8.3. Europe
8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by resin type
8.3.3. Market size and forecast, by curing technique
8.3.4. Market size and forecast, by application
8.3.4.1. Market size and forecast, by electrical application
8.3.4.2. Market size and forecast, by electronics application
8.3.4.3. Market size and forecast, by electrical application
8.3.4.4. Market size and forecast, by electronics application
8.3.5. Market size and forecast, by end-user
8.3.6. Market share analysis, by country
8.3.7. France
8.3.7.1. Market size and forecast, by resin type
8.3.7.2. Market size and forecast, by curing technique
8.3.7.3. Market size and forecast, by application
8.3.7.3.1. Market size and forecast, by electrical application
8.3.7.3.2. Market size and forecast, by electronics application
8.3.7.3.3. Market size and forecast, by electrical application
8.3.7.3.4. Market size and forecast, by electronics application
8.3.7.4. Market size and forecast, by end-user
8.3.8. Germany
8.3.8.1. Market size and forecast, by resin type
8.3.8.2. Market size and forecast, by curing technique
8.3.8.3. Market size and forecast, by application
8.3.8.3.1. Market size and forecast, by electrical application
8.3.8.3.2. Market size and forecast, by electronics application
8.3.8.3.3. Market size and forecast, by electrical application
8.3.8.3.4. Market size and forecast, by electronics application
8.3.8.4. Market size and forecast, by end-user
8.3.9. UK
8.3.9.1. Market size and forecast, by resin type
8.3.9.2. Market size and forecast, by curing technique
8.3.9.3. Market size and forecast, by application
8.3.9.3.1. Market size and forecast, by electrical application
8.3.9.3.2. Market size and forecast, by electronics application
8.3.9.3.3. Market size and forecast, by electrical application
8.3.9.3.4. Market size and forecast, by electronics application
8.3.9.4. Market size and forecast, by end-user
8.3.10. Spain
8.3.10.1. Market size and forecast, by resin type
8.3.10.2. Market size and forecast, by curing technique
8.3.10.3. Market size and forecast, by application
8.3.10.3.1. Market size and forecast, by electrical application
8.3.10.3.2. Market size and forecast, by electronics application
8.3.10.3.3. Market size and forecast, by electrical application
8.3.10.3.4. Market size and forecast, by electronics application
8.3.10.4. Market size and forecast, by end-user
8.3.11. Italy
8.3.11.1. Market size and forecast, by resin type
8.3.11.2. Market size and forecast, by curing technique
8.3.11.3. Market size and forecast, by application
8.3.11.3.1. Market size and forecast, by electrical application
8.3.11.3.2. Market size and forecast, by electronics application
8.3.11.3.3. Market size and forecast, by electrical application
8.3.11.3.4. Market size and forecast, by electronics application
8.3.11.4. Market size and forecast, by end-user
8.3.12. Rest of Europe
8.3.12.1. Market size and forecast, by resin type
8.3.12.2. Market size and forecast, by curing technique
8.3.12.3. Market size and forecast, by application
8.3.12.3.1. Market size and forecast, by electrical application
8.3.12.3.2. Market size and forecast, by electronics application
8.3.12.3.3. Market size and forecast, by electrical application
8.3.12.3.4. Market size and forecast, by electronics application
8.3.12.4. Market size and forecast, by end-user
8.4. Asia-Pacific
8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by resin type
8.4.3. Market size and forecast, by curing technique
8.4.4. Market size and forecast, by application
8.4.4.1. Market size and forecast, by electrical application
8.4.4.2. Market size and forecast, by electronics application
8.4.4.3. Market size and forecast, by electrical application
8.4.4.4. Market size and forecast, by electronics application
8.4.5. Market size and forecast, by end-user
8.4.6. Market share analysis, by country
8.4.7. India
8.4.7.1. Market size and forecast, by resin type
8.4.7.2. Market size and forecast, by curing technique
8.4.7.3. Market size and forecast, by application
8.4.7.3.1. Market size and forecast, by electrical application
8.4.7.3.2. Market size and forecast, by electronics application
8.4.7.3.3. Market size and forecast, by electrical application
8.4.7.3.4. Market size and forecast, by electronics application
8.4.7.4. Market size and forecast, by end-user
8.4.8. China
8.4.8.1. Market size and forecast, by resin type
8.4.8.2. Market size and forecast, by curing technique
8.4.8.3. Market size and forecast, by application
8.4.8.3.1. Market size and forecast, by electrical application
8.4.8.3.2. Market size and forecast, by electronics application
8.4.8.3.3. Market size and forecast, by electrical application
8.4.8.3.4. Market size and forecast, by electronics application
8.4.8.4. Market size and forecast, by end-user
8.4.9. Japan
8.4.9.1. Market size and forecast, by resin type
8.4.9.2. Market size and forecast, by curing technique
8.4.9.3. Market size and forecast, by application
8.4.9.3.1. Market size and forecast, by electrical application
8.4.9.3.2. Market size and forecast, by electronics application
8.4.9.3.3. Market size and forecast, by electrical application
8.4.9.3.4. Market size and forecast, by electronics application
8.4.9.4. Market size and forecast, by end-user
8.4.10. South Korea
8.4.10.1. Market size and forecast, by resin type
8.4.10.2. Market size and forecast, by curing technique
8.4.10.3. Market size and forecast, by application
8.4.10.3.1. Market size and forecast, by electrical application
8.4.10.3.2. Market size and forecast, by electronics application
8.4.10.3.3. Market size and forecast, by electrical application
8.4.10.3.4. Market size and forecast, by electronics application
8.4.10.4. Market size and forecast, by end-user
8.4.11. Australia
8.4.11.1. Market size and forecast, by resin type
8.4.11.2. Market size and forecast, by curing technique
8.4.11.3. Market size and forecast, by application
8.4.11.3.1. Market size and forecast, by electrical application
8.4.11.3.2. Market size and forecast, by electronics application
8.4.11.3.3. Market size and forecast, by electrical application
8.4.11.3.4. Market size and forecast, by electronics application
8.4.11.4. Market size and forecast, by end-user
8.4.12. Rest of Asia-Pacific
8.4.12.1. Market size and forecast, by resin type
8.4.12.2. Market size and forecast, by curing technique
8.4.12.3. Market size and forecast, by application
8.4.12.3.1. Market size and forecast, by electrical application
8.4.12.3.2. Market size and forecast, by electronics application
8.4.12.3.3. Market size and forecast, by electrical application
8.4.12.3.4. Market size and forecast, by electronics application
8.4.12.4. Market size and forecast, by end-user
8.5. LAMEA
8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by resin type
8.5.3. Market size and forecast, by curing technique
8.5.4. Market size and forecast, by application
8.5.4.1. Market size and forecast, by electrical application
8.5.4.2. Market size and forecast, by electronics application
8.5.4.3. Market size and forecast, by electrical application
8.5.4.4. Market size and forecast, by electronics application
8.5.5. Market size and forecast, by end-user
8.5.6. Market share analysis, by country
8.5.7. Brazil
8.5.7.1. Market size and forecast, by resin type
8.5.7.2. Market size and forecast, by curing technique
8.5.7.3. Market size and forecast, by application
8.5.7.3.1. Market size and forecast, by electrical application
8.5.7.3.2. Market size and forecast, by electronics application
8.5.7.3.3. Market size and forecast, by electrical application
8.5.7.3.4. Market size and forecast, by electronics application
8.5.7.4. Market size and forecast, by end-user
8.5.8. Saudi Arabia
8.5.8.1. Market size and forecast, by resin type
8.5.8.2. Market size and forecast, by curing technique
8.5.8.3. Market size and forecast, by application
8.5.8.3.1. Market size and forecast, by electrical application
8.5.8.3.2. Market size and forecast, by electronics application
8.5.8.3.3. Market size and forecast, by electrical application
8.5.8.3.4. Market size and forecast, by electronics application
8.5.8.4. Market size and forecast, by end-user
8.5.9. South Africa
8.5.9.1. Market size and forecast, by resin type
8.5.9.2. Market size and forecast, by curing technique
8.5.9.3. Market size and forecast, by application
8.5.9.3.1. Market size and forecast, by electrical application
8.5.9.3.2. Market size and forecast, by electronics application
8.5.9.3.3. Market size and forecast, by electrical application
8.5.9.3.4. Market size and forecast, by electronics application
8.5.9.4. Market size and forecast, by end-user
8.5.10. Rest of LAMEA
8.5.10.1. Market size and forecast, by resin type
8.5.10.2. Market size and forecast, by curing technique
8.5.10.3. Market size and forecast, by application
8.5.10.3.1. Market size and forecast, by electrical application
8.5.10.3.2. Market size and forecast, by electronics application
8.5.10.3.3. Market size and forecast, by electrical application
8.5.10.3.4. Market size and forecast, by electronics application
8.5.10.4. Market size and forecast, by end-user
Chapter: 9: COMPANY PROFILES
9.1. 3M
9.1.1. Company overview
9.1.2. Company snapshot
9.1.3. Operating business segments
9.1.4. Product portfolio
9.1.5. Business performance
9.2. Altana
9.2.1. Company overview
9.2.2. Company snapshot
9.2.3. Operating business segments
9.2.4. Product portfolio
9.2.5. Business performance
9.2.6. Key strategic moves and developments
9.3. Aremco Products Inc.
9.3.1. Company overview
9.3.2. Company snapshot
9.3.3. Operating business segments
9.3.4. Product portfolio
9.4. DowDuPont
9.4.1. Company overview
9.4.2. Company snapshot
9.4.3. Operating business segments
9.4.4. Product portfolio
9.4.5. Business performance
9.5. Dymax Corporation
9.5.1. Company overview
9.5.2. Company snapshot
9.5.3. Operating business segments
9.5.4. Product portfolio
9.6. Henkel AG & Co. KGaA
9.6.1. Company overview
9.6.2. Company snapshot
9.6.3. Operating business segments
9.6.4. Product portfolio
9.6.5. Business performance
9.6.6. Key strategic moves and developments
9.7. Hitachi Chemical Co., Ltd.
9.7.1. Company overview
9.7.2. Company snapshot
9.7.3. Operating business segments
9.7.4. Product portfolio
9.7.5. Business performance
9.8. Huntsman International LLC
9.8.1. Company overview
9.8.2. Company snapshot
9.8.3. Operating business segments
9.8.4. Product portfolio
9.8.5. Business performance
9.9. LORD Corporation
9.9.1. Company overview
9.9.2. Company snapshot
9.9.3. Product portfolio
9.10. Master Bond Inc.
9.10.1. Company overview
9.10.2. Company snapshot
9.10.3. Product portfolio
9.10.4. Key strategic moves and developments
9.11. MG Chemicals
9.11.1. Company overview
9.11.2. Company snapshot
9.11.3. Product portfolio
9.12. RBC Industries, Inc.
9.12.1. Company overview
9.12.2. Company snapshot
9.12.3. Operating business segments
9.12.4. Product portfolio
9.13. Shanghai SEPNA Chemical Technology Co., Ltd.
9.13.1. Company overview
9.13.2. Company snapshot
9.13.3. Operating business segments
9.13.4. Product portfolio
9.14. Wacker Chemie AG
9.14.1. Company overview
9.14.2. Company snapshot
9.14.3. Operating business segments
9.14.4. Product portfolio
9.14.5. Business performance
9.15. Wevo-Chemie GmbH
9.15.1. Company overview
9.15.2. Company snapshot
9.15.3. Product portfolio
Chapter: 1: INTRODUCTION
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Secondary research
1.4.2. Primary research
1.5. Analyst tools and models
Chapter: 2: EXECUTIVE SUMMARY
2.1. Key findings of the study
2.2. CXO perspective
Chapter: 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top investment pockets
3.2.2. Top winning strategies
3.3. Porter’s five forces analysis
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Perfectly suitable properties for electronic applications
3.4.1.2. Increased consumer electronic industry output and trend for miniaturization
3.4.2. Restraint
3.4.2.1. Improper section of potting resin
3.4.3. Opportunity
3.4.3.1. Gradual adoption of two component polyurethane potting compounds
3.5. Top player positioning, 2017
Chapter: 4: GLOBAL POTTING COMPOUNDS MARKET, BY RESIN TYPE
4.1. Overview
4.1.1. Market size and forecast
4.2. Epoxy
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis, by country
4.3. Polyurethane
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis, by country
4.4. Silicone
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis, by country
4.5. Polyester
4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market share analysis, by country
4.6. Polyamide
4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market share analysis, by country
4.7. Polyolefin
4.7.1. Key market trends, growth factors, and opportunities
4.7.2. Market size and forecast, by region
4.7.3. Market share analysis, by country
4.8. Acrylics
4.8.1. Key market trends, growth factors, and opportunities
4.8.2. Market size and forecast, by region
4.8.3. Market share analysis, by country
Chapter: 5: GLOBAL POTTING COMPOUNDS MARKET, BY CURING TECHNIQUE
5.1. Overview
5.1.1. Market size and forecast
5.2. UV Curing
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis, by country
5.3. Thermal Curing
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis, by country
5.4. Room Temperature Curing
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market share analysis, by country
Chapter: 6: GLOBAL POTTING COMPOUNDS MARKET, BY APPLICATION
6.1. Overview
6.1.1. Market size and forecast
6.2. Electrical
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market size and forecast, by type
6.2.4. Market share analysis, by country
6.3. Electronics
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market size and forecast, by type
6.3.4. Market share analysis, by country
Chapter: 7: GLOBAL POTTING COMPOUNDS MARKET, BY END USER
7.1. Overview
7.1.1. Market size and forecast
7.2. Electronics
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market share analysis, by country
7.3. Aerospace
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market share analysis, by country
7.4. Automotive
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market share analysis, by country
7.5. Industrial
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market share analysis, by country
7.6. Others
7.6.1. Key market trends, growth factors, and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market share analysis, by country
Chapter: 8: GLOBAL POTTING COMPOUNDS MARKET, BY REGION
8.1. Overview
8.1.1. Market size and forecast
8.2. North America
8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by resin type
8.2.3. Market size and forecast, by curing technique
8.2.4. Market size and forecast, by application
8.2.4.1. Market size and forecast, by electrical application
8.2.4.2. Market size and forecast, by electronics application
8.2.4.3. Market size and forecast, by electrical application
8.2.4.4. Market size and forecast, by electronics application
8.2.5. Market size and forecast, by end-user
8.2.6. Market share analysis, by country
8.2.7. U.S.
8.2.7.1. Market size and forecast, by resin type
8.2.7.2. Market size and forecast, by curing technique
8.2.7.3. Market size and forecast, by application
8.2.7.3.1. Market size and forecast, by electrical application
8.2.7.3.2. Market size and forecast, by electronics application
8.2.7.3.3. Market size and forecast, by electrical application
8.2.7.3.4. Market size and forecast, by electronics application
8.2.7.4. Market size and forecast, by end-user
8.2.8. Canada
8.2.8.1. Market size and forecast, by resin type
8.2.8.2. Market size and forecast, by curing technique
8.2.8.3. Market size and forecast, by application
8.2.8.3.1. Market size and forecast, by electrical application
8.2.8.3.2. Market size and forecast, by electronics application
8.2.8.3.3. Market size and forecast, by electrical application
8.2.8.3.4. Market size and forecast, by electronics application
8.2.8.4. Market size and forecast, by end-user
8.2.9. Mexico
8.2.9.1. Market size and forecast, by resin type
8.2.9.2. Market size and forecast, by curing technique
8.2.9.3. Market size and forecast, by application
8.2.9.3.1. Market size and forecast, by electrical application
8.2.9.3.2. Market size and forecast, by electronics application
8.2.9.3.3. Market size and forecast, by electrical application
8.2.9.3.4. Market size and forecast, by electronics application
8.2.9.4. Market size and forecast, by end-user
8.3. Europe
8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by resin type
8.3.3. Market size and forecast, by curing technique
8.3.4. Market size and forecast, by application
8.3.4.1. Market size and forecast, by electrical application
8.3.4.2. Market size and forecast, by electronics application
8.3.4.3. Market size and forecast, by electrical application
8.3.4.4. Market size and forecast, by electronics application
8.3.5. Market size and forecast, by end-user
8.3.6. Market share analysis, by country
8.3.7. France
8.3.7.1. Market size and forecast, by resin type
8.3.7.2. Market size and forecast, by curing technique
8.3.7.3. Market size and forecast, by application
8.3.7.3.1. Market size and forecast, by electrical application
8.3.7.3.2. Market size and forecast, by electronics application
8.3.7.3.3. Market size and forecast, by electrical application
8.3.7.3.4. Market size and forecast, by electronics application
8.3.7.4. Market size and forecast, by end-user
8.3.8. Germany
8.3.8.1. Market size and forecast, by resin type
8.3.8.2. Market size and forecast, by curing technique
8.3.8.3. Market size and forecast, by application
8.3.8.3.1. Market size and forecast, by electrical application
8.3.8.3.2. Market size and forecast, by electronics application
8.3.8.3.3. Market size and forecast, by electrical application
8.3.8.3.4. Market size and forecast, by electronics application
8.3.8.4. Market size and forecast, by end-user
8.3.9. UK
8.3.9.1. Market size and forecast, by resin type
8.3.9.2. Market size and forecast, by curing technique
8.3.9.3. Market size and forecast, by application
8.3.9.3.1. Market size and forecast, by electrical application
8.3.9.3.2. Market size and forecast, by electronics application
8.3.9.3.3. Market size and forecast, by electrical application
8.3.9.3.4. Market size and forecast, by electronics application
8.3.9.4. Market size and forecast, by end-user
8.3.10. Spain
8.3.10.1. Market size and forecast, by resin type
8.3.10.2. Market size and forecast, by curing technique
8.3.10.3. Market size and forecast, by application
8.3.10.3.1. Market size and forecast, by electrical application
8.3.10.3.2. Market size and forecast, by electronics application
8.3.10.3.3. Market size and forecast, by electrical application
8.3.10.3.4. Market size and forecast, by electronics application
8.3.10.4. Market size and forecast, by end-user
8.3.11. Italy
8.3.11.1. Market size and forecast, by resin type
8.3.11.2. Market size and forecast, by curing technique
8.3.11.3. Market size and forecast, by application
8.3.11.3.1. Market size and forecast, by electrical application
8.3.11.3.2. Market size and forecast, by electronics application
8.3.11.3.3. Market size and forecast, by electrical application
8.3.11.3.4. Market size and forecast, by electronics application
8.3.11.4. Market size and forecast, by end-user
8.3.12. Rest of Europe
8.3.12.1. Market size and forecast, by resin type
8.3.12.2. Market size and forecast, by curing technique
8.3.12.3. Market size and forecast, by application
8.3.12.3.1. Market size and forecast, by electrical application
8.3.12.3.2. Market size and forecast, by electronics application
8.3.12.3.3. Market size and forecast, by electrical application
8.3.12.3.4. Market size and forecast, by electronics application
8.3.12.4. Market size and forecast, by end-user
8.4. Asia-Pacific
8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by resin type
8.4.3. Market size and forecast, by curing technique
8.4.4. Market size and forecast, by application
8.4.4.1. Market size and forecast, by electrical application
8.4.4.2. Market size and forecast, by electronics application
8.4.4.3. Market size and forecast, by electrical application
8.4.4.4. Market size and forecast, by electronics application
8.4.5. Market size and forecast, by end-user
8.4.6. Market share analysis, by country
8.4.7. India
8.4.7.1. Market size and forecast, by resin type
8.4.7.2. Market size and forecast, by curing technique
8.4.7.3. Market size and forecast, by application
8.4.7.3.1. Market size and forecast, by electrical application
8.4.7.3.2. Market size and forecast, by electronics application
8.4.7.3.3. Market size and forecast, by electrical application
8.4.7.3.4. Market size and forecast, by electronics application
8.4.7.4. Market size and forecast, by end-user
8.4.8. China
8.4.8.1. Market size and forecast, by resin type
8.4.8.2. Market size and forecast, by curing technique
8.4.8.3. Market size and forecast, by application
8.4.8.3.1. Market size and forecast, by electrical application
8.4.8.3.2. Market size and forecast, by electronics application
8.4.8.3.3. Market size and forecast, by electrical application
8.4.8.3.4. Market size and forecast, by electronics application
8.4.8.4. Market size and forecast, by end-user
8.4.9. Japan
8.4.9.1. Market size and forecast, by resin type
8.4.9.2. Market size and forecast, by curing technique
8.4.9.3. Market size and forecast, by application
8.4.9.3.1. Market size and forecast, by electrical application
8.4.9.3.2. Market size and forecast, by electronics application
8.4.9.3.3. Market size and forecast, by electrical application
8.4.9.3.4. Market size and forecast, by electronics application
8.4.9.4. Market size and forecast, by end-user
8.4.10. South Korea
8.4.10.1. Market size and forecast, by resin type
8.4.10.2. Market size and forecast, by curing technique
8.4.10.3. Market size and forecast, by application
8.4.10.3.1. Market size and forecast, by electrical application
8.4.10.3.2. Market size and forecast, by electronics application
8.4.10.3.3. Market size and forecast, by electrical application
8.4.10.3.4. Market size and forecast, by electronics application
8.4.10.4. Market size and forecast, by end-user
8.4.11. Australia
8.4.11.1. Market size and forecast, by resin type
8.4.11.2. Market size and forecast, by curing technique
8.4.11.3. Market size and forecast, by application
8.4.11.3.1. Market size and forecast, by electrical application
8.4.11.3.2. Market size and forecast, by electronics application
8.4.11.3.3. Market size and forecast, by electrical application
8.4.11.3.4. Market size and forecast, by electronics application
8.4.11.4. Market size and forecast, by end-user
8.4.12. Rest of Asia-Pacific
8.4.12.1. Market size and forecast, by resin type
8.4.12.2. Market size and forecast, by curing technique
8.4.12.3. Market size and forecast, by application
8.4.12.3.1. Market size and forecast, by electrical application
8.4.12.3.2. Market size and forecast, by electronics application
8.4.12.3.3. Market size and forecast, by electrical application
8.4.12.3.4. Market size and forecast, by electronics application
8.4.12.4. Market size and forecast, by end-user
8.5. LAMEA
8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by resin type
8.5.3. Market size and forecast, by curing technique
8.5.4. Market size and forecast, by application
8.5.4.1. Market size and forecast, by electrical application
8.5.4.2. Market size and forecast, by electronics application
8.5.4.3. Market size and forecast, by electrical application
8.5.4.4. Market size and forecast, by electronics application
8.5.5. Market size and forecast, by end-user
8.5.6. Market share analysis, by country
8.5.7. Brazil
8.5.7.1. Market size and forecast, by resin type
8.5.7.2. Market size and forecast, by curing technique
8.5.7.3. Market size and forecast, by application
8.5.7.3.1. Market size and forecast, by electrical application
8.5.7.3.2. Market size and forecast, by electronics application
8.5.7.3.3. Market size and forecast, by electrical application
8.5.7.3.4. Market size and forecast, by electronics application
8.5.7.4. Market size and forecast, by end-user
8.5.8. Saudi Arabia
8.5.8.1. Market size and forecast, by resin type
8.5.8.2. Market size and forecast, by curing technique
8.5.8.3. Market size and forecast, by application
8.5.8.3.1. Market size and forecast, by electrical application
8.5.8.3.2. Market size and forecast, by electronics application
8.5.8.3.3. Market size and forecast, by electrical application
8.5.8.3.4. Market size and forecast, by electronics application
8.5.8.4. Market size and forecast, by end-user
8.5.9. South Africa
8.5.9.1. Market size and forecast, by resin type
8.5.9.2. Market size and forecast, by curing technique
8.5.9.3. Market size and forecast, by application
8.5.9.3.1. Market size and forecast, by electrical application
8.5.9.3.2. Market size and forecast, by electronics application
8.5.9.3.3. Market size and forecast, by electrical application
8.5.9.3.4. Market size and forecast, by electronics application
8.5.9.4. Market size and forecast, by end-user
8.5.10. Rest of LAMEA
8.5.10.1. Market size and forecast, by resin type
8.5.10.2. Market size and forecast, by curing technique
8.5.10.3. Market size and forecast, by application
8.5.10.3.1. Market size and forecast, by electrical application
8.5.10.3.2. Market size and forecast, by electronics application
8.5.10.3.3. Market size and forecast, by electrical application
8.5.10.3.4. Market size and forecast, by electronics application
8.5.10.4. Market size and forecast, by end-user
Chapter: 9: COMPANY PROFILES
9.1. 3M
9.1.1. Company overview
9.1.2. Company snapshot
9.1.3. Operating business segments
9.1.4. Product portfolio
9.1.5. Business performance
9.2. Altana
9.2.1. Company overview
9.2.2. Company snapshot
9.2.3. Operating business segments
9.2.4. Product portfolio
9.2.5. Business performance
9.2.6. Key strategic moves and developments
9.3. Aremco Products Inc.
9.3.1. Company overview
9.3.2. Company snapshot
9.3.3. Operating business segments
9.3.4. Product portfolio
9.4. DowDuPont
9.4.1. Company overview
9.4.2. Company snapshot
9.4.3. Operating business segments
9.4.4. Product portfolio
9.4.5. Business performance
9.5. Dymax Corporation
9.5.1. Company overview
9.5.2. Company snapshot
9.5.3. Operating business segments
9.5.4. Product portfolio
9.6. Henkel AG & Co. KGaA
9.6.1. Company overview
9.6.2. Company snapshot
9.6.3. Operating business segments
9.6.4. Product portfolio
9.6.5. Business performance
9.6.6. Key strategic moves and developments
9.7. Hitachi Chemical Co., Ltd.
9.7.1. Company overview
9.7.2. Company snapshot
9.7.3. Operating business segments
9.7.4. Product portfolio
9.7.5. Business performance
9.8. Huntsman International LLC
9.8.1. Company overview
9.8.2. Company snapshot
9.8.3. Operating business segments
9.8.4. Product portfolio
9.8.5. Business performance
9.9. LORD Corporation
9.9.1. Company overview
9.9.2. Company snapshot
9.9.3. Product portfolio
9.10. Master Bond Inc.
9.10.1. Company overview
9.10.2. Company snapshot
9.10.3. Product portfolio
9.10.4. Key strategic moves and developments
9.11. MG Chemicals
9.11.1. Company overview
9.11.2. Company snapshot
9.11.3. Product portfolio
9.12. RBC Industries, Inc.
9.12.1. Company overview
9.12.2. Company snapshot
9.12.3. Operating business segments
9.12.4. Product portfolio
9.13. Shanghai SEPNA Chemical Technology Co., Ltd.
9.13.1. Company overview
9.13.2. Company snapshot
9.13.3. Operating business segments
9.13.4. Product portfolio
9.14. Wacker Chemie AG
9.14.1. Company overview
9.14.2. Company snapshot
9.14.3. Operating business segments
9.14.4. Product portfolio
9.14.5. Business performance
9.15. Wevo-Chemie GmbH
9.15.1. Company overview
9.15.2. Company snapshot
9.15.3. Product portfolio
Allied Market Research